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WECC Global Standard and Technology Committee hold meeting in conjunction with CPCA SHOW 2009 in Shanghai. On March 18, 14:00-16:00 in the Pudong Blue Horizon Royal Park Lane International Hotel, WECC Global Standard and Technology Committee hold the meeting. The meeting Chair, Mr. Shibata-san introduced the latest development in global standardization including IEC standard progress and the JPCA standard activities in electronic circuits. Following standards from JPCA are introduced on the meeting.
1. "Revised JPCA-EB01, Board with Embedded Passive and Active Component" JPCA prepared the 1st edition of this document in June last year but we are in process of revising the document to include some details of design guide of the boards. We are also planning to submit the new document to IEC as a technical specification but we consider the document should also be introduced to WECC members.
2. "Evaluation of Electrochemical Migration" The original Japanese edition of this document was prepared in 2005 and revised in 2007. This document was translated into English last summer and has been checked by members both JPCA and JIEP. We are also planning to submit this document to IEC as a technical report. The document is of about 100 pages and covers most of the basic aspects of electrochemical migration included CAF. We believe this document is a very good source of information to engineers working in printed wiring boards.
3. "Optical back plane" JPCA has prepared three documents in this area last year in bilingual. Opto-electronic assembly is not fully used in the industry but we believe these documents provide with the basic technology in opto-electronic assembly which must be used in systems of very near future. These documents will be discussed by IEC TC86(Optical fibres)/TC91(Electronics assembly technology)/JWG9 (Optoelectric functionality). A document we call G&G-general and guidance is also prepared by TC86/TC91/JWG9. I should like to introduce these documents also to members of WECC Standard Commitee if appropriate.
4. "The defects and causes of electronic circuit board" The first edition of this document was prepared in 2004 and the revised edition in 2007 all in Japanese. The trilinngual (Japanese, English and Chinese) edition of this document was prepared last year and shown to WECC members at the 2008 JPCA Show. This document can be used by WECC members and somewhat detailed explanation of this document should be of benefit to the members.
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